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Intel ditches lead from upcoming chips PDF Print E-mail
Written by Darren Yates   
Wednesday, 23 May 2007




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New Penryn processors become environmentally friendly with no lead inside.

Lead was once a significant part in the electronics industry, used as an alloy in solder that joined electronic components together. However, chip manufacturer Intel has announced that its upcoming 45-nanometre processors will be all lead-free.

This includes the upcoming versions of its Core 2 Duo, Core 2 Quad and Xeon chips.

The chip heavyweight expects to also update its older 65-nanometre processors to lead-free status during 2008.

Intel says a tin-silver-copper alloy will replace the lead previously used in solder connections. For years, the industry has used a 60-40% tin-lead solder because of its relatively low melting temperature and smooth joining ability. Intel has been using 95% less lead in its processors since 2004 and with its new alloy, is now able to remove the remaining 5%. The company says that it has a new alloy recipe that it is not disclosing that enables it to achieve the same reliability and practical results as its previously 5%-lead alloy.

Intel’s announcement is a sign of the times as the electronics manufacturing industry promotes greater concern for the environment through the Reduction of Hazardous Substances (RoHS) directive. Adopted by the European Union in 2003 and coming into effect on July 1, 2006, RoHS is being adopted by a number of PC component companies in Asia including Gigabyte. While it has not yet been fully ratified by the US, there is growing effort by companies such as IBM and Intel to reduce the use of hazardous substances in manufacture.

The RoHS directive aims the greatly reduce the use of six substances, most notably Lead, Mercury and Cadmium.

Intel states it has a strong heritage in environmental concern that dates back to Intel founder Gordon Moore. It is currently working with the European Union on how the electronics industry can help it to reduce greenhouse gas emissions by 20% by the year 2020.

Intel’s upcoming 45-nanometre processors, using a hi-K silicon technology, will reduce the amount of power required to drive the internal transistors, allowing vendors to develop smaller, light and more power-efficient computers.

 





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